New Delhi: In a significant boost to India’s semiconductor manufacturing sector, the Union Cabinet chaired by Prime Minister Narendra Modi has approved four new projects under the India Semiconductor Mission (ISM), with a combined investment of ₹4,600 crore.
The projects – proposed by SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies – will be established in Odisha, Punjab, and Andhra Pradesh.
Collectively, they are expected to generate direct employment for 2,034 skilled professionals and drive substantial indirect job creation through the electronics manufacturing ecosystem.
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With these approvals, the total sanctioned projects under ISM have reached 10, representing cumulative investments of around ₹1.60 lakh crore across six states.
Semiconductor Manufacturing Projects: Highlights
- SiCSem Private Limited – Odisha
- In collaboration with Clas-SiC Wafer Fab Ltd., UK, SiCSem will set up India’s first commercial Silicon Carbide (SiC) compound semiconductor fabrication facility in Info Valley, Bhubaneswar.
- The fab will have an annual capacity of 60,000 wafers and packaging for 96 million units. The devices will cater to applications in missiles, defence equipment, electric vehicles (EVs), railways, fast chargers, solar power inverters, data centres, and consumer appliances.
- 3D Glass Solutions Inc. – Odisha
- 3D Glass Solutions will establish a vertically integrated advanced packaging and embedded glass substrate facility in Bhubaneswar.
- This unit will introduce advanced semiconductor packaging technologies to India, including glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules.
- Annual production is expected to reach 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules, with applications in defence, AI, high-performance computing, RF and automotive, photonics, and co-packaged optics.
- Advanced System in Package (ASIP) Technologies – Andhra Pradesh
- ASIP will set up a semiconductor manufacturing plant in partnership with APACT Co. Ltd., South Korea, with an annual capacity of 96 million units. The products will serve mobile phones, set-top boxes, automotive electronics, and other consumer devices.
- Continental Device India Private Limited (CDIL) – Punjab
- CDIL will expand its Mohali facility to produce high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors in both silicon and silicon carbide.
- The plant will have an annual capacity of 158.38 million units, with applications in EVs, renewable energy, industrial electronics, and communication infrastructure.
Strategic Impact
The newly approved projects introduce India’s first commercial compound semiconductor fabrication unit and a state-of-the-art glass-based packaging facility, strengthening the country’s presence in high-value segments of the global semiconductor supply chain.
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These semiconductor manufacturing initiatives will complement India’s growing chip design capabilities, supported by government-backed design infrastructure in 278 academic institutions and 72 startups.
Over 60,000 students have already benefited from semiconductor talent development programmes, further building a skilled workforce for the industry.
The four new facilities align with national priorities such as Atmanirbhar Bharat, Make in India, and the country’s ambition to emerge as a global hub for semiconductor manufacturing.
